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Thermal compound for heat sink.
Silicone compound blended with thermally conductive fine metal oxide powders.
Thermal paste is a thermally conductive chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices.
Excellent heat transfer efficiency.
Will not harden or melt.
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As opposed to thermal adhesive thermal paste does not add mechanical strength to the bond between heat source and heat s.
These compounds are commonly used with transistors diodes rectifiers and transformers.
The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation.
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Thermal paste is an example of a thermal interface material.
Zinc oxide compounds create a more secure bond than silicone compounds.
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Super lube silicone heat sink 3 oz.
Wigbow thermal compound paste heatsink paste carbon based high performance thermal compound cpu for all coolers thermal interface material high durability 4 grams 1 pack 4 6 out of 5 stars 315 6 99 6.
Heat sink compounds bond heat sinks to surfaces eliminating air gaps for maximum heat transfer.
Temperature range from 45 degrees f to 500 degrees f.
This is a test.
All the energy is absorbed by the cpu grease to ensure it only flows to the heatsink and not to any of the computer s internal circuitry something that is of particular importance for gaming pcs.