When used as an adhesive the thermally conductive filler has very fine particle sizes.
Thermally conductive epoxy high temperature.
50 3186 nc is a two part thermally conductive epoxy adhesive.
Master bond ep30tc is a multifaceted epoxy for use in thermal management applications.
Sets at room temp.
Thermally conductive high temperature epoxy adhesive max 425f heat cure low viscosity.
Duralco 132 offers the maximum conductivity available in a 500ºf epoxy system.
Thermo bond 100 is designed for the fastest and most continuous high heat transfer.
Good to 130 c 265 f omegabond 101two part epoxy.
50 3186 nc is a perfect choice for applications requiring high thermal conductivity low thermal expansion and high operating temperature performance.
Duralco 132 500 f aluminum filled epoxy.
Thermally conductive epoxy adhesive black alumina filled casting low exotherm.
Thermally conductive high temperature epoxy adhesive max 425f heat cure low viscosity.
Aluminum metal filled epoxy that cures at room temp to form machinable thermally conductive bond lines.
It is a specialty formulation that can be used for bonding coating sealing and encapsulation.
Subsequently it can be applied in sections as thin as 5 15 microns.
Serviceable from 100 f to 400 f.
Features exceptional thermal conductivity.
Resist oils solvents most acids.
Idea for joining dissimilar substrates.
Thermo bond 180 is designed for the fastest and most continuous high heat transfer.
Aremco bond 805 a new high temperature thermally conductive epoxy system developed by aremco products inc is now for bonding potting and molding applications to 300 ºc 572 ºf.
Very high thermal conductivity.
Thermally conductive electrically insulating heat cure epoxy high temperature resistance.
Serviceable from cryogenic temperatures up to 400 f.
Good to 105 c 221 f omegabond 200 two part epoxy.
Thermal adhesive tape 20mm by 25m hpfix high performance thermally conductive tape apply for coolers heat sink led strips computer cpu gpu easy to apply high durability 4 4 out of 5 stars 101 12 99 12.
Can be supplied as a non sag putty for heat tracing applications.
Aremco bond 805 is a two component 100 solids aluminum filled epoxy ideal for bonding potting and tooling applications to 300 ºc 572 ºf.
Sets at room temp.
Thermo bond 54 is recommended for high temperature aerospace and electronic applications where the c.
Two part room temperature curable epoxy system with high thermal conductivity.