Alumina is the material of choice for most thick film ceramic substrates delivering durable cost effective performance for hybrid electronic circuits with proven reliability.
Thick film ceramic substrates.
Mpt is a one stop shop for your thick film substrate needs.
Why ceramic thick film substrates.
Thin film circuits are prepared by vacuum deposition usually evaporation or sputtering of relatively thin layers of metals or compounds onto ceramic substrates.
Cms circuit solutions is a producer of sophisticated custom thick film ceramic printed and etched substrates.
Thick film materials normally require heat treatment in the region of 850 c to form a glassy bond with the ceramic substrate.
Thick film substrates are electronic circuit boards generally made from ceramics.
Used in the fabrication of chip and wire hybrid circuits leadless chip carrier motherboards sensor elements assemblies etc.
Kyocera produces alumina substrates with excellent thick film reliability tightly controlled dimensions no more than 0 25 and small through holes as small as 0 2mm which enable greater density and precision in thick film circuits.
Thick film substrates kyocera s thick film substrates correspond to the increased density and precision of thick film circuits.
Thickfilm substrate with printed through holes resistors multilayer dielectric pd ag and au conductor and protective glass encapsulation.
The facility is iso 9001 2008 certified for the design production and testing of thick film resistors thick film chip attenuators thick film ceramic substrates and surface mount assemblies and ltcc.
A typical thick film process would consist of the following stages.
The ceramic is screened with conductor insulator and resistor material to form the circuitry.
Your one stop provider for ceramic packaging solutions.
Coorstek has engineered different grades formulations and thicknesses to provide an optimal fit for a variety of.
Modeling simulation and beta development.
Superior resistor stability is achieved by controlling increase in strength over the standard ads 96r.
Mpt thick film technology is robust economical and can reduce the footprint of your circuit.
Remtec uses pctf and other advanced technologies to design and produce cost effective custom and semi custom packaging solutions metallized substrates packages and components for power electronics optoelectronics and rf mw applications in commercial industrial and military industries.
Ads 96r thick film substrates are engineered to minimize adsr 96r thick film durastrate substrates are a as fired resistor variations and maximize aged adhesion fine grained material which offers greater than a 20 values.